3rd EAI International Workshop on Integrated Space and Onboard Networks (ISON 2021).
To be held at (EAI WiSATS 2021 conference), Harbin, China.
Scope
In order to enhance the utilizations of satellites, there are increasing requirements for interconnecting different satellites such as remote sensing satellites, navigation satellites, telecommunication satellites, deep space satellites, manned spacecraft, etc.
International Workshop on Integrated Space and Onboard Networks (ISON) aims to discuss challenges, opportunities, and solutions in protocol architecture, software architecture, hardware architecture of space data systems. The workshop plans to focus on the latest advances in theories, methods, and practices in this interdisciplinary research.
Topics
Topics of interest include, but are not limited to, the following scope:
- [Distributed spacecraft avionics systems]
- [Spacecraft onboard interfaces services]
- [Space link services]
- [Space internetworking services]
- [Delay tolerant networks]
- [Onboard high-performance computer design]
- [Onboard wireless communications]
- [Onboard high speed data bus]
- [Spacecraft electronic data sheet]
- [Information flow design and simulation of space and onboard network]
- [Model based onboard software design]
- [AI in space]
Important dates
Paper submission deadline: 9 June 2021
Notification deadline: 22 June 2021
Camera-ready deadline: 26 July 2021 (extended!)
Video submission deadline: 25 July 2021
Publication
Accepted and presented technical papers will be submitted for publication by Springer and made available through SpringerLink Digital Library. Workshop Papers will be published as a part of the (EAI WiSATS 2021) Conference Proceedings. Proceedings will be submitted for inclusion in leading indexing services, including Ei Compendex, ISI Web of Science, Scopus, CrossRef, Google Scholar, DBLP, as well as EAI’s own EU Digital Library (EUDL).
Submission
We invite workshop participation through contributions that respond to one or more of the mentioned research questions in 6-11 pages. Papers should be submitted through EAI ‘Confy+’ system, and have to comply with the Springer format (see Author’s kit section).